R-LOGITECH 

BOND

KEY DATA BOND 2018/2023

IssuerR-LOGITECH S.A.M.
Issued amountEUR 200 million
WKN/ISINA19WVN/DE000A19WVN8
Coupon8.5 % p.a.
Issue price100 %
Term5 years
Value date29 March 2018
Interest paymentAnnually in arrears on 29 March of each year (in 2019 for the first time)
Redemption price100 %
Redemption date29 March 2023
DenominationEUR 1,000
StatusUnsubordinated, unsecured
CovenantsNegative pledge, change of control, cross-default, 50% limitation on dividend
DocumentationApproved prospectus in Luxembourg with notification to Germany (BaFin)
Stock exchangeOpen Market of Deutsche Börse AG ("Freiverkehr" of the Frankfurt Stock Exchange)
Global Coordinator & BookrunnerBankM - Repräsentanz der FinTech Group Bank AG

FINANCIAL CALENDAR

3 February 2021Preliminary results 2020
30 April 2021Annual report 2020
29 March 2021Interest payment for the bond 2018/2023 (ISIN: DE000A19WVN8)
August 2021Half-year report 2021

R-LOGITECH

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