R-LOGITECH 

BOND

KFM-Barometer - Juni 2022

Documents

Investor Update Q4 2023
Update
Update on refinancing - Jan. 2024
Investor Update Q3 2023
Investor Update H1 2022
Investor Update Q1 2022
Prospectus
Terms & Conditions of the Notes
R-Logitech Company Presentation

Financial Reports

Half-year Report 2023
Financial Report 2022
Half-year Report 2022
Financial Report 2021
Half-year Report 2021
Financial Report 2020
Half-year Report 2020
Financial Report 2019
Half-year Report 2019
Financial Report 2018
Half-year Report 2018
Financial Report 2017

Press Contact

R-LOGITECH S.A.M.
+377 97 98 67 71
investorrelations@r-logitech.com

KEY DATA BOND 2018/2024

IssuerR-LOGITECH S.A.M.
Issued amountEUR 200 million
WKN/ISINA3LJCA/DE000A3LJCA6
Coupon10.25 % p.a.
Issue price100 %
Term6 years
Value date29 March 2018
Interest paymentAnnually in arrears on 29 March of each year (in 2019 for the first time)
Redemption price100 %
Redemption date24 June 2024
DenominationEUR 1,085
StatusUnsubordinated, secured
CovenantsNegative pledge, change of control, cross-default, 50% limitation on dividend
DocumentationApproved prospectus in Luxembourg with notification to Germany (BaFin)
Stock exchangeOpen Market of Deutsche Börse AG ("Freiverkehr" of the Frankfurt Stock Exchange)
Global Coordinator & BookrunnerBankM - Repräsentanz der FinTech Group Bank AG

R-LOGITECH

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